PRODUCTS

DIE BONDING TOOL

Die bonding is the process of attaching the wafer sheet dither to PCB or to lead-frame.

PRODUCTS

WIRE BONDING

The process of connecting the wire to PAD, PCB, and LEAD FRAME of the chip.

PRODUCTS

DISPENSING

The process of forming a protective film with a solution to protect the chip.

PRODUCTS

BACK END

Die bonding is the process of attaching the wafer sheet dither to PCB or to lead-frame.