MSW SUNGJIN Tech
Prepare the future of better technology.
2020.03.20
2017.02.21
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We strive for constant development and innovation.
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PRODUCTS
DIE BONDING TOOL
Die bonding is the process of attaching the wafer sheet dither to PCB or to lead-frame.
WIRE BONDING
The process of connecting the wire to PAD, PCB, and LEAD FRAME of the chip.
DISPENSING
The process of forming a protective film with a solution to protect the chip.
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