MSW Korea

MSW SUNGJIN Tech

Prepare the future of better technology.

2020.03.20
ASIA TV ECONOMY - Enterprise field(20.03.18)
2017.02.21
SEMICON KOREA 2017

Foundation

0
Employees

0
Revenue(KRW)

0
Certification

0

PRODUCTS

DIE BONDING TOOL

Die bonding is the process of attaching the wafer sheet dither to PCB or to lead-frame.
PRODUCTS

WIRE BONDING

The process of connecting the wire to PAD, PCB, and LEAD FRAME of the chip.
PRODUCTS

DISPENSING

The process of forming a protective film with a solution to protect the chip.
PRODUCTS

BACK END

Die bonding is the process of attaching the wafer sheet dither to PCB or to lead-frame.

82, Jomaru-ro 411beon-gil 82, Wonmi-gu, Bucheon-si, Gyeonggi-do
TEL +82-32-654-0355
FAX +82-32-654-0357

Copyright (c) MSW SUNGJIN Tech. All rights reserved.