MSW SUNGJIN Tech - Prepare the future of better technology
DIE BONDING TOOL
Memory Semiconductor and Fingerprint Sensor Chip Pick up & Attach improves the void phenomenon. The combined role of back metal makes it easier to remove and attach the tool stably by magnetic force, and maintain flatness in the Attach process.
We are producing stable and high quality products with precise processing of Back Metal and Silicon Rubber with flatness of less than 5μm.
Silicon Rubber collet
It is a soft silicon-based collet that can be applied as a pick-up water target, such as Scratch and Crack. It is manufactured by mold and is easy for mass production.
Rubber collet Holder
Metal and Silicon It is a medium hardness material and it is a high functional resin with high molecular structure. It is excellent in abrasion resistance, corrosion resistance, heat resistance, chemical stability, insulation, tensile property and is suitable for shape processing.
Various special design shapes can be processed by precision machining technology and it can be manufactured in a short time according to customer schedule.
According to our own precision processing equipment, it is possible to process various special design shapes by technology.
Ceramic material is a non-metallic solid of inorganic compound, and can work reliably in nonconductivity and resistance to electrical properties.
Vacuum hole processing can be applied to miniature chip pick up applications such as Mini Micro LED.
The ejector pin is an auxiliary tool for chip pick up attached to the mounting tape and is applied to three kinds of products (general, thin film, small die) suitable for various applications.
CLASSIFICATION BY MATERIAL
Ejector Cap & Holder
AD830 / AD8930 / Etc
Epoxy adhesive liquid is dotted according to die size to enable stable and fast production speed.
Clamp & Block