PRODUCTS

MSW SUNGJIN Tech - Prepare the future of better technology

DISPENSING

Nozzle

  • Description : Applied with Jet Dispensing fluid glue(such as Epoxy, etc…) in LED hi-power-chip Die-Bonding Process
  • Application : Manual or Auto Dispenser machines, such as Musashi, NEC, etc…
  • Meterial : Nickel alloy
  • Spectification: 1. Standard types, 2. Customer-made for Customers’ needs.
  • Description : Applied to Sealant Patterning glue of LCD(Liquid Crystal Display) Cell Process
  • Application : HITACHI Automatic Dispensing Machine
  • LCD Factory Generations : 3G, 4G, 5G, 6G, 7G
  • Meterial : Nickel alloy
  • Spectification: 1. Standard types, 2. Customer-made for Customers’ needs.
  • Description : Applied with Dispensing fluid glue(such as Epoxy, etc …) in IC-package Die-Bonding Process
  • Application : Any brands of Auto Dispenser machines
  • Meterial : Nickel alloy
  • Spectification: 1. Standard types, 2. Customer-made for Customers’ needs.

Clamp & Block

Pump kit Part